

- MAX5986BETE+ - 集成电路(IC) > 电源管理(PMIC) > 以太网供电(PoE)控制器
- MAX206EEWG - 集成电路(IC) > 接口 > 驱动器,接收器,收发器
- MAX1845ETX+T - 集成电路(IC) > 电源管理(PMIC) > DC-DC 开关控制器
- MAX5070BAUA+ - 集成电路(IC) > 电源管理(PMIC) > DC-DC 开关控制器
- MAX858CSA - 集成电路(IC) > 电源管理(PMIC) > 稳压器 - DC-DC 开关稳压器
- DS1305E+ - 集成电路(IC) > 时钟/定时 > 实时时钟
- MAX34407EVKIT# - 开发板,套件,编程器 > 评估板 > 评估和演示板及套件
- MAX6138BEXR41+T - 集成电路(IC) > 电源管理(PMIC) > 电压基准
- MAX793TCSE-T - 集成电路(IC) > 电源管理(PMIC) > 监控器
- MAX474CSA - 集成电路(IC) > 线性 > 放大器 > 仪器,运算放大器,缓冲器
- MAX6250BCSA+T - 集成电路(IC) > 电源管理(PMIC) > 电压基准
- MAX6720AUTSVD3+T - 集成电路(IC) > 电源管理(PMIC) > 监控器
- MAX4478ASD+T - 集成电路(IC) > 线性 > 放大器 > 仪器,运算放大器,缓冲器
- MAX3033EESE+ - 集成电路(IC) > 接口 > 驱动器,接收器,收发器
- MAX31888EVSYS# - 开发板,套件,编程器 > 评估板 > 传感器评估板
- MAX13082EEPA+ - 集成电路(IC) > 接口 > 驱动器,接收器,收发器
- MAX40201FAUA+T - 集成电路(IC) > 线性 > 放大器 > 仪器,运算放大器,缓冲器
- MAX3523ETP+T - 射频和无线 > 射频放大器
- MAX3245ECAI - 集成电路(IC) > 接口 > 驱动器,接收器,收发器
- MAX9022AKA+T - 集成电路(IC) > 线性 > 比较器



DS9096P - iButton粘垫
DS9096P是Maxim美信半导体公司的一款iButton器件产品,DS9096P是iButton粘垫,本站介绍了DS9096P的封装应用图解、特点和优点、功能等,并给出了与DS9096P相关的Maxim元器件型号供参考。
DS9096P - iButton粘垫 - iButton器件 - Maxim美信半导体高性能芯片品质 - 美信半导体
The DS9096P is a made of white, double-coated acrylic VHB™ foam tape (3M part number 4932) that is die-cut to match the diameter of iButton® devices. The pads allow iButtons to be attached to virtually any smooth surface. The DS9096P offers an excellent long-term holding power for use in many interior and exterior industrial applications.
The DS9096P works best on low surface energy substrates, including most metal, sealed wood and glass, as well as many plastics, composites, and painted surfaces. Porous (e.g., concrete) or fiberous materials (e.g., wood) will require sealing to provide a unified surface. Materials such as copper, brass, plasticized vinyl may require priming or coating to prevent interaction between adhesive and substrate. Bonding to glass, ceramic tile or other hydrophilic surfaces in a high humidity environment may require the use of a silane coupling-agent to help ensure a long-term bond. Rough surfaces created by light abrasion may actually be detrimental to bond strength.
Before applying the DS9096P, clean the surface of the objects thoroughly with a mixture of 50% isopropyl alcohol and 50% water and wipe it dry. Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure develops better adhesion contact and thus improves bond strength. For good surface contact apply enough pressure to ensure that the tape experiences approximately 15psi (100kPa). Typically, uniform thumb pressure on the iButton will achieve the desired result. At room temperature approximately 50% of the ultimate bonding strength is achieved after 20 minutes, 90% after 24 hours and 100% after 72 hours.
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- MAX1626 - 5V/3.3V或可调、100%占空比、高效率、降压型DC-DC控制器



